The Technology

Engineered to the Die.

CoolX is an AI-predictive direct-to-chip liquid cooling platform built for NVIDIA H100 and B200 GPU clusters. Our LSTM model integrates NVIDIA DCGM telemetry to predict GPU junction temperature 30 minutes ahead — adjusting coolant flow proactively before thermal throttling can occur.

Direct-to-Chip Hardware

Coolant at the source. Not the rack.

Traditional air and immersion cooling treat the entire rack as a thermal unit. CoolX delivers liquid coolant directly to the GPU die — targeting individual NVIDIA H100 and B200 processors with precision flow control. The result is 10× better thermal conductivity than air, validated at 76°C junction temperature under 700W H100 load with 35°C warm water and no chiller required.

10×
vs. air cooling
Thermal Conductivity

Direct-to-chip liquid delivery achieves thermal conductivities that air and rack-level cooling cannot approach — keeping every NVIDIA GPU at peak performance.

±0.5°C
per-chip control
Coolant Flow Precision

Individual microvalves regulate coolant flow per GPU. Each H100 or B200 gets exactly the thermal management it needs — no more, no less.

24%
vs. legacy systems
Cooling Energy Reduction

Proactive, AI-directed flow eliminates overcooling waste. CoolX delivers 24% cooling energy reduction while maintaining full GPU performance under sustained load.

76°C
at 700W TDP, 35°C warm water
Junction Temperature

Validated at full 700W H100 TDP load with 35°C warm-water supply — well inside safe operating limits, no throttling, no chiller required.

Direct-to-Chip Liquid Delivery

Coolant is routed directly to the GPU die surface, extracting heat at the point of generation. CoolX targets individual NVIDIA H100 and B200 processors — not the rack, not the row — eliminating thermal crosstalk between adjacent GPUs.

Precision Microvalve Array

Each GPU is fed by an individually addressable microvalve. The CoolX controller adjusts flow rates per chip in under 50ms — faster than any thermal event can propagate across the cluster.

Manifold Distribution System

A low-pressure coolant manifold distributes fluid across the rack with redundant feed paths. Single-point failures are isolated automatically without interrupting cooling to adjacent GPUs.

Chiller-Free Warm Water Operation

CoolX operates with 35°C warm-water supply — no chiller infrastructure required. Compatible with facility warm water loops, dramatically reducing capital and operational cooling costs.

AI Predictive Thermal Management

The LSTM model that sees heat before it happens.

CoolX's LSTM model integrates NVIDIA DCGM telemetry — GPU utilization, power draw, memory bandwidth, and NVLink throughput — to predict GPU junction temperature 30 minutes ahead within ±1.8°C. It doesn't just monitor temperature; it models the thermal trajectory of every GPU in the cluster and adjusts coolant flow proactively before throttling can occur.

30 minPrediction horizon
±1.8°CForecast accuracy
1kHzDCGM sample rate
< 50msValve response time
01

NVIDIA DCGM Telemetry Integration

CoolX ingests real-time DCGM metrics — GPU utilization, power consumption, memory bandwidth, SM clock frequency, and NVLink throughput — at 1kHz resolution. This telemetry feeds the LSTM model continuously, building a live thermal model of every H100 and B200 in the cluster.

02

30-Minute Junction Temperature Forecasting

The LSTM model predicts GPU junction temperature 30 minutes ahead within ±1.8°C. Dense matrix operations, transformer attention layers, and all-reduce communication patterns each produce distinct thermal signatures that the model identifies and projects forward with high confidence.

03

Proactive Coolant Flow Adjustment

When the model forecasts a heat spike, it pre-stages coolant flow to the at-risk GPU before the predicted event. The chip never approaches its thermal limit. Throttling is structurally impossible — the system acts on the forecast, not the temperature reading.

04

Cluster-Level Thermal Orchestration

In multi-GPU configurations, the AI coordinates cooling across the entire cluster — preventing thermal cascades where heat from one GPU elevates ambient conditions for its neighbors. The system thinks in clusters, not chips, protecting every NVIDIA GPU deployed in AI factories and data centers.

CoolX vs. Legacy Cooling

The difference between reactive and predictive.

FeatureLegacy CoolingCoolX
Cooling triggerTemperature threshold breachLSTM forecast 30 min before breach
Telemetry sourceAmbient sensors onlyNVIDIA DCGM — full GPU telemetry
GranularityRack or row levelPer-GPU, per-die
Throttle eventsFrequent under peak loadZero — guaranteed by SLA
Cooling energyBaseline24% reduction
Chiller requiredYes — significant CAPEXNo — 35°C warm water supply
GPU densityThermally limited3× increase per rack
InstallationInfrastructure overhaulDrop-in, < 4hr per rack

Ready to see the thermal model in action?

We'll run a live LSTM simulation against your H100 or B200 workload profile and show you exactly where your current cooling is leaving GPU performance on the table.